Munich, August 24 , 2010. This year's hybridica, which is being held in conjunction with electronica in Munich for the second time from 9 - 12 November 2010, will focus on the topic of MID technology. Molded interconnect devices (MIDs) are injection-molded parts that can have any shape and feature integrated circuit structures. They are predominantly used on the automotive industry, telecommunications, medical technology and industrial automation. They also have a great deal of application and streamlining potential in the electronics industry. At the "3-D MID" joint exhibit in Hall C1, more than a dozen companies will give visitors a look at MID technology and present their products and innovations.
 
 
"Progress in the sector for structuring, metalizing and assembly/packaging technology, but above all in the use of thermoplastic materials, is opening up new dimensions for circuit substrates in various branches of industry. This development is underscored by a number of new mass-production applications. As a trade fair for hybrid components, hybridica is exactly the right platform for us to introduce MID technology to an audience of industry professionals," explains Christian Goth from "3-D MID e.V. – Räumliche Elektronische Baugruppen".
 
Using the right engineering technology, customized hybrid components such as molded interconnect devices can now be produced in large batch sizes. Thanks to their design flexibility, environmental compatibility and enormous production-streamlining potential, MID technology offers several ways to implement innovative products and efficient production processes. Integrating mechanical and electronic features into a single component is characteristic of this hybrid technology, which is being presented at hybridica 2010. Depending on the application in question, other functions such as optical or fluid functions can also be integrated in the injection-molding process or through subsequent structuring/metallization. Among other things, design flexibility makes it possible to integrate touch-operation and antenna structures. If designed accordingly, fastening elements, stiffeners and cooling fins can also be integrated directly into the housing.
 
Several companies will present MID technologies as mass-production applications for a wide variety of applications at the "3-D MID e.V." network's joint exhibition stand. They include 2E mechatronic, Evonik Degussa, Häcker Automation, Harting, Laser Micronics, LEONI Bordnetz-Systeme, Lüberg, MID Solutions, PKT and Wiesauplast. Other participants include the Institute for Manufacturing Automation and Production Systems (Erlangen University) the Heinz-Nixdorf Institute, the Institute for Micro Assembly Technology in the Hahn-Schickard-Gesellschaft e.V. (HSG-IMAT) and "3-D MID e.V. – Räumliche Elektronische Baugruppen" itself. Thanks to its presentation of MID technology, hybridica – a trade fair for suppliers and processors of hybrid components – is an additional attraction for industry professionals attending electronica.  
 
About 3-D MID e. V.
The Research Association Molded Interconnect Devices 3-D MID e.V. was founded in Erlangen in 1992 in order to support the numerous, interdisciplinary tasks in the introduction of the MID technology. For this, the specific knowledge of the various disciplines needs to be bundled and exchanged. The Research Association comprises companies as well as research institutes concerned with design and engineering, materials, tooling and molding, metallization, structuring, and the downstream processing with assembly, connection technology and connectors as well as users of the technology. The objective of the Research Association is to support and develop of the MID- technology. This includes joint research projects, promotion of experience exchange among the members and initiation of the realization of the new technical opportunities by suitable publications and activities like fair participation and conference organization. More information is available at www.3d-mid.de


Press contact:
Kathrin Hagel
Press office hybridica
Messe München GmbH
Phone: +49 (0) 89 / 949-20651
email:: kathrin.hagel@messe-muenchen.de

Sven Linge
teamtosse GmbH
Phone: +49 (0)89 /459 1158-30
emaill: hybridica@teamtosse.de