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No. 3 / July 15, 2010

hybridica 2010 interim report: Registrations at positive level - Technology leaders present all aspects of hybrid technology

Munich, July 15, 2010. Contrary to the tense economical situation, the number of companies registered for second hybridica has slightly grown as compared to this point the last time the fair was held. As a result, the trade fair for the development and manufacture of hybrid components will present the entire value chain for this future technology again this year. An extensive program of related events with lectures by renowned companies and presentations of integrated manufacturing solutions for precision stamping and injection-molding processes will inform visitors about the sector's state of art. The fair is being held at the New Munich Trade Fair Centre from November 9 – 12, 2010. Admission tickets are also valid for the world's leading trade fair electronica, which takes place at the same time.
 
As trade fair for suppliers and machining the exhibits at hybridica 2010 cover the entire range of hybrid technology, from preliminary products, design and development to production plants and customized hybrid components. Composite components made of metal, plastic and even ceramics have now become indispensible in many high-tech industries such as electronics/electrical engineering, the automotive industry, medical technology and the sectors for communications, household appliances and power engineering. Experts estimate that more than 60 percent of all metal parts are now combined with plastics – and the trend is rising.
Ellen Richter-Maierhofer, Exhibition Director for hybridica, is convinced that the fair is on the right track as a gathering for this new and innovative industry: "The reception among exhibiting companies has been very positive. In the hybrid-technology sector, industrial customers expect precision and process reliability from their supply partners – even with the most delicate components – and that at optimum costs. To achieve that objective, they must take the entire value chain into account, from preliminary product to the finished component. And exactly that is hybridica's special strength."

At hybridica 2010, leading manufacturers in the sector for hybrid technology including Adduxi, Bogner, Conttek, G.Rau, Härter Stanztechnik, Kummer, Leicht + Müller, Walter Söhner and Swoboda will demonstrate their expertise in metals and plastics processing as well as precision stamping and injection molding of thermoplastics and thermosetting plastics.
As always, the fair will also play a great deal of attention to machine concepts for integrating and automating process flows for composite parts. The manufacturing specialists that have registered for the fair include Créde, Leicht Stanzautomation, Paul Cramer, MMS Modular Molding Systems and Schroeder + Bauer. Exhibitors in the sector for preliminary products, tool and die manufacturing and surface treatment include Ami DODUCO, Aurubis, Enayati, Gebr. Kemper, IMO Oberflächentechnik, Prym Inovan, Roth Werkzeugbau and Wieland-Werke.

At the 3D-MID joint exhibit, more than a dozen companies will give visitors a look at MID technology. MIDs (molded interconnect devices) are opening up new application and efficiency-improving potential in the electronics industry. Once again, hybridica 2010 is being held at the same time as the leading international trade fair electronica, where the international who's who of the electronics industry – one of the most important demand markets for hybrid components – are gathered.

A list of companies that have already registered for the fair is available online www.hybridica.de/en/Home/Exhibitors/exhibitor-list
 

Press contact:
Kathrin Hagel
Press office hybridica
Messe München GmbH
Phone: +49 (0) 89 / 949-20651
email:: kathrin.hagel@messe-muenchen.de

Sven Linge
teamtosse GmbH
Phone: +49 (0)89 /459 1158-30
emaill: hybridica@teamtosse.de
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